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Shenzhen
Tel: +86-755-8624 1806, +86-755-8197 0125
Fax: +86-755-2657 3392
[email protected]

Shanghai
Tel: +86-21-6441 6123
Fax: +86-21-6441 6123
[email protected]

All our Products are RoHs compliant
GUARANTEE


LEDs:
At correct voltage and current in friendly circumstance: 100,000 hours. Failure rate based on long time testings: less than 1 per 10,000,000 light hours.
Light declination:
  • Hewlett Packard/Cree chips 5% of brightness after 30~40,000 hours. (Price is 3~4 times as normal chips).
  • Other our chips (Optotech etc.) 50% of brightness after 30~40,000 hours.

Precautions

Static Electricity and Surge
Static electricity and surge damage LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded.

Lead Forming
The leads should be bent at a point at least
3mm from the epoxy resin of the LEDs.
Bending should be performed with the base
firmly fixed by means of a jig or radio pliers.


Mounting Method
The leads should be formed so they are aligned exactly with the holes on the PC board. This will eliminate any stress on the LEDs.

Use LEDs with stoppers or resin spacer to accurately position the LEDs. The epoxy resin base should not be touching the PC board when mounting the LEDs. Mechanical stress to the resin may be caused by the warping of the PC board when soldering.
The LEDs must not be designed into a product or system where the epoxy lens is pressed into a plastic or metal board. The lens part of the LED must not be glued onto plastic or metal. The mechanical stress to the leadframe must be minimized.
Soldering conditions:
Soldering Iron
Dip Soldering
Reflow Soldering
Lamp LED
300degC(max), 3sec(max)
260degC(max)5sec(max)
Not allowed.



Chip LED


300degC(max), 3sec(max) with Twin Head iron


Not allowed.

Copyright ã 2006-2011  EVERREDtronics  Ltd.  All rights reserved.
Any copying, distribution, re-transmission or publication is strictly prohibited without the written consent of the Company.



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Cleaning
Avoid exposure to chemicals as they may attack the LED surface and cause discoloration. When washing is required, "isopropyl alcohol" is to be used.
The influence of ultrasonic cleaning on the LEDs differs depending on factors such as oscillator output and the way in which the LEDs are mounted. Therefore, ultrasonic cleaning should only be performed after making certain that it will not cause any damage.

Emission color
LED emission wavelengths vary. LEDs are classified by emission color into different ranks. When a large volume of LEDs are purchased, LEDs with different color ranks will be delivered

Packaging
The leadframes of the LEDs are coated with silver. Care must be taken to maintain a clean storage atmosphere. If the LEDs are exposed to gases such as hydrogen sulfide, it may cause discoloration of the leadframes.
Moistureproof packing is used to keep moisture away from the chip type LEDs. When storing chip type LEDs, please use a sealable package with a moisture absorbent material inside.

Soldering
Solder the LEDs no closer than 3mm from the base of the epoxy resin.
For solder dipping, it may be necessary to fix the LEDs for correct positioning. When doing this, any mechanical stress to the LEDs must be avoided.
When soldering, do not apply any mechanical force to the leadframe while heating.

Repositioning after soldering must be avoided.